CPL Engineering and Architecture Scholarship and Internship - SEAS

Established by Richard B. Henry, III BS ’90 and Deidre M. Henry, BA 90. Must be a junior majoring in Civil, Structural, Mechanical, or Electrical Engineering in the School of Engineering and Applied Sciences. Preference given to a student from an underrepresented* community in engineering. This is a non-tuition scholarship and can be used to help with expenses including, but not limited to: fees, books, and room and board.

Financial need is considered for eligibility of this opportunity. Applicants should file an annual FAFSA. Students ineligible to file a FAFSA may demonstrate financial need on the General Application by selecting “Yes” to the Financial Hardship question and providing a brief summary of their circumstances (if “No,” leave blank).

The student selected to receive this scholarship will also be offered a paid internship at CPL Architecture Engineering Planning, available either during the academic year or the winter/summer break.

*For purposes of this opportunity, the term underrepresented is intended to refer to individuals who have been historically underrepresented in a particular field of study, profession, or educational pathway based on factors such as socioeconomic background (e.g. Pell eligibility), first-generation college status, geographic origin, educational access, AmeriCorps alumni status, veteran status, or other unprotected characteristics. This term does not establish preference based on race, sex, ethnicity, or any other protected classification under applicable federal or state law.